Gap Pad EMI 1.0

Gap Pad EMI 1.0 - photo by Henkel

Gap Pad EMI 1.0 (photo by Henkel)

In the converting industry we deal with a lot of materials. When you deal with materials ranging from 1 mil Mylar A to modified epoxy adhesive films, you gain a peculiar affinity for materials that stand out from the rest. Recently, I was introduced to an especially versatile material called Gap Pad EMI 1.0. This material features so many benefits that I thought it would be interesting to write a blog about them.

In a world where electronics run the planet, thermal management has become vital for us to power up the devices that we use on a daily basis. For the last 30 years, Henkel has been manufacturing materials that are designed to fill air gaps in high heat electronics to better facilitate heat transfer. In addition, EMC has also become equally important because all of the electromagnetic waves these devices produce. The waves tend to collide into other devices and cause issues. Thankfully, Henkel has developed an engineered material that deals with all of these problems simultaneously. Gap Pad EMI 1.0 is a fiberglass-reinforced Gap Pad that offers EMI suppression as well as thermal conductivity to provide an affordable solution in consumer electronics and PC applications. This material’s fiberglass reinforcement makes it especially durable, resisting punctures and tears while simultaneously offering high conformability, in order to wet out onto various substrates to maintain a good level of thermal conductivity. The material is able to absorb energy at 1GHz or higher. While providing EMI absorption, it also features a thermal conductivity of 1.0 (W/m-K), which is extremely impressive considering its ability to absorb EMI energy. While the pad absorbs EMI energy, it is incredibly electrically isolating making it even more versatile. The dielectric constant of this material can reach up to 6.0 at 1000Hz. Gap Pad EMI 1.0 offers properties of a wide temperature range (-76°F-392°F), and a stringent compliance with UL 94 V0. With all of these qualities, Gap Pad EMI 1.0 is able to wrap many beneficial properties into one convenient and affordable package.

Part of the versatility of Gap Pad materials is the wide range of thicknesses available; it is available in thicknesses from 20mils to 125mils. The material features a natural tack on one side that comes with a protective liner. An inherent tack in place of an adhesive ensures that no thermal conductivity is lost through an adhesive layer.

The natural color of this material is black. The standard ordering number string for this part is: GPEMI1.0-X.XXX-01-0816-NA, the X.XXX is replaced by the standard thicknesses available on the imperial system. NEDC can supply custom die-cut shapes from this material. The applications that have this thermal Gap Pad can be be quite diversified. For more information on Gap Pad EMI 1.0 or thermal interface materials please contact sales@nedc.com.

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